Maximizing the Value of Horizontal and Multilateral Wells: New Challenges, Technologies, and Approaches
8-11 March 2009
Eastern & Oriental Hotel
Penang, Malaysia
This workshop will serve as a stimulus for new applications of multilateral and horizontal well technologies. Sessions will address candidate selection, modeling well performance, and optimizing well production with intelligent completions. There will be a particular focus on current challenges for multilateral well technology including selective intervention into all laterals, intelligent well instrumentation in multilateral wells, and performance predictions of complex well architectures. Lessons learned from the field will be used to illustrate how to achieve a better practice of this advancing technology.
Besides providing excellent networking opportunities, the workshop will focus on the following areas of discussion:
- Reservoir characterization for application of multilateral well technology – geology and geoscience considerations
- Reservoir simulation of complex well systems
- Drilling and completion of multilateral wells
- Multilateral well performance and optimization
- Intelligent completions in multilateral wells
- Field case histories
- Future developments
Workshop Objectives
This comprehensive and focused workshop will allow participants to:
- Review the latest technical advancements and identify challenges in multilateral wells
- Discuss new and novel applications through technical sessions and case studies
- Network with fellow participants from other companies and countries
- Exchange ideas with fellow practitioners through group problem-solving sessions
- Discuss in-depth the problems/solutions and applications that could add value to their company and job
Who Should Attend
- Geoscientist
- Drilling/Completion Engineers
- Reservoir Engineers
- Production Engineers
- Project Managers and Asset Managers
For further information, please contact the SPE Asia Pacific Office at tel. +60.3.2288.1233, fax +60.3.2282.1220 or e-mail spekl@spe.org.
